on ‎2021 Oct 13 5:29 AM
Dear Experts,
Note - 2779323 speaks about transfer of packing instructions as packing specifications to EWM system.
Regarding packspec change, the note reads as below :
Description: Packaging specification header carries a logical system (LOGSYS). If this value of this field in EWM is equal to the logical system (LOGSYS) of the system & client, the packaging specification knows that the current system is the owner and primary system and allows for maintenance. You can change packaging specifications in EWM, and these changes can be triggered in ERP as well. However, these changes won’t be replicated to EWM again to avoid overwriting.
We are using embedded EWM and would like to centrally maintain the packing instruction and have the changes transferred to the packing specifications.
Please suggest.
Thanks,
Mageshwaran Sivasamy
Request clarification before answering.
Dear Roland,
We took this topic to SAP and we were told that change transfer of packing instructions to EWM is not supported in the embedded environment.
Did you work with this topic in embedded environment using developments ?
Thanks,
Magesh
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Hello Roland,
Thanks a lot for the update.
Even after implementing all the notes, we still have error /SCWM/PS_BASICS 233.
"Packing specification has logical system X , can not be replicated to original system".
Do you have any idea how to overcome it ?
Thanks,
Magesh
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Hello Mageshwaran,
at our client the ERP system is the owner and primary system for distribution of the packaging information to embedded EWM. We have faced same issues that CIF replication did not trigger correctly the packaging data or condition records after any change in POP2 or POF2 transaction. After many incidents raised to SAP following Notes are necessary for S/4HANA 2020 release and downwards.
The last SAP note is not yet released for customers yet or it might be under updation. You may have to wait for its official release or you contact SAP directly and they will release the Note specifically for your customer.
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Hello Zhang,
Below is the question.
Changing a packing instruction should update the corresponding packing spec in embedded EWM.
How to achieve it ?
Thanks,
Mageshwaran Sivasamy
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