Hello gurus,
Looking for advice for inventory control of substrate fabrication. Fundamentally, how do we configure SAP such that 1 piece of a component (wafer) may yield different QTY's of sub-assemblies (sliced die), and plan MRP at the wafer level?
We use a wafer, say W-1, that may be printed into different size die based on the pattern being dispensed. This affects the yield of the wafer- EX, we can yield 121 of D-1 and 242 of D-2 using 1 piece of W-1 based on the print of the die. My question is, how do we configure SAP to plan to order the correct QTY of W-1 with these requirements? We are not able to use a fractional QTY of the die BOM for the wafer (i.e. a die BOM to consume 1/121 wafer per W-1 die). We have heard of solutions using UoM conversion (where 1 die EA = 1 die Sq Inches, so 121 Sq. Inches = 1 Ea Wafer). I have also heard solutions for alternate BOMs based on lot sizing... could this apply here also?
(1) W-1 -> (121) D-1 -> (121) Assembly-1; Demand for 1,000 Assemlby 1
(1) W-1 -> (242) D-2 -> (242) Assembly-2; Demand for 6,000 Assembly 2
How to get SAP to plan to order ~34 W-1?
Using R/3 release 7.3
Regards,
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